Semiconductor Packaging Mold
Number: PL-BDT01
Manufacturer: Dongguan Pengle Precision Components Co., Ltd.
Place of Origin: Dongguan
Accuracy: 0.005mm
Specification: customized
Delivery time: 7 days
Manufacturer: Peng Le
Main processing equipment: CNC machining center, mirror spark machine, slow wire walking，grinder
Product number: PL-BDT01
Product range: machinery and equipment, computers, televisions, medical care, automobiles, etc.
Dongguan Pengle Precision Components Co., Ltd. is a manufacturer, processing and manufacturer of precision molds for mobile phones.Over the past 15 years, Peng Le has continuously introduced advanced technology and equipment from Germany and Japan，establish a unique standardized quality control center,recruit and train talents who have been focusing on mobile phone mid-board and mobile phone precision accessories for more than 10 years,optimize the ISO management model,create a modular, transparent and modern factory with a unique style in the industry.
Main processing equipment: CNC machining center, mirror spark machine, slow wire walking，grinder
Product number: PL-BDT01
Product range: machinery and equipment, computers, televisions, medical care, automobiles, etc.
Dongguan Pengle Precision Components Co., Ltd. is a manufacturer, processing and manufacturer of precision molds for mobile phones.Over the past 15 years, Peng Le has continuously introduced advanced technology and equipment from Germany and Japan，establish a unique standardized quality control center,recruit and train talents who have been focusing on mobile phone mid-board and mobile phone precision accessories for more than 10 years,optimize the ISO management model,create a modular, transparent and modern factory with a unique style in the industry.
